1. Business status
DIT is based on optical design technology and light control technology, precision mechanical design and control technology. It not only manufactures PCB, semiconductor and other traditional field equipment, but also devotes itself to the production engineering essential patterning in the rapidly developing new tree species industry, such as amdled, flexible display, TSP, led, solar cell, etc Repairing.Lift off, Drilling, Cutting.Scribing . Soldering.Bonding And other engineering equipment development and manufacturing.
2. Technical summary
The concept of laser
·Laser, Light Amplification by Stimulated Emission of Radiation, means the phenomenon of amplifiedlight by stimulated emission.
The Concept of Laser
The laser generator is generally composed of: (1) total mirror (2) 95% reflection & 5% transmission mirror (3) laser resonator (4) pumping source (diode or flash lamp) (5) gain medium (solid State.Gas.Liquid (semi conductor, etc.)
The oscillation process is as follows: if the energy of (3) and (4) between (1) and (2) is given, the electrons in (5) will exit. If (5) energy is continuously supplied, the density of electrons will change and reach saturation state. The exiting electrons will lower their energy levels and emit light in the form of (6) emission beams through (2)
Laser types and flexible application fields
Laser is widely used in most industries, especially in semiconductor or display material processing or medical application
Laser equipment by use
General construction of laser equipment
Laser application equipment is composed of laser source and optical engine for transmitting laser source to target object: direct focusing module and scanning module according to processing mode; stage for transferring products to destination; work table for handling products; lsorator for cutting off external vibration; frame and cover for supporting equipment.
Classification by the construction of laser equipment
- Direct Focus Type
Application Industry: it is mainly used in precision machining, transmitting and processing products in the fixed beam state. Principle: beam barrier is excited from laser source (1) mechanical shutter (2) beam amplifier (3) beam intensity attenuator (5) successively passes through focusing lens, and finally (6) irradiates the object, and (4) beam divergence device and (7) CCD camera image analysis.
-Area Scan Type
Application Industry: mainly used in large area high-speed machining principle: 1) offset beam on the plane through galvano scanner motor, and (2) use scarner lens to process parts needed to be processed.
3.market size
Laser application equipment market has been growing since laser was developed. The development of semiconductor and display industry has also contributed to the application equipment market of laser. Moreover, the ultra precision related industry is closely related to laser application equipment. It is expected that the ultra precision related industry will grow by more than 400% from 2005 to 2015. Therefore, it is also expected that the laser equipment industry will get considerable growth.
4.core technology
DIT has many years of experience and technical means in optical, mechanical, control, software and other fields, which can be called the core technology of laser application equipment. Therefore, a variety of materials and more precise processing technology can be realized.
5.Advance direction
DIT is not only in semiconductor or display, but also in all material industries that require ultra precision machining, striving to be the next generation leader in the field of laser equipment
1.Cutting equipment
Optical film cutting equipment
-outline
The polarizer of display or fpr film for 3DTV use laser cutting equipment
Equipment specifications
Device image
Application / Application
Thin / thin cutting equipment
-outline
Edge grinding and full cutting equipment for thick & thin semiconductor pie tube socket
It mainly uses blade, dry laser mode or steady mode. Recently, it is applied in laser micro jet mode
Device image
Application / Application
Glass processing equipment(Scribing,Cutting)
-outline
Display, touch panel, MEMS and other equipment for glass cutting mainly use wheel scribing & breaking,. Laserthermal crack, steal, wet etch, sandblast, etc. DIT uses a variety of different laser sources to provide solutions.
-Examples of representative glass cutting methods
Application / Application
2.FPCB / PCB processing equipment(Drilling, Patterning ,Cutting, Structuring)
-outline
The latest laser technology is to use single laser source in all working applications of rigid and flexible PCB.
UV laser (355nm of THG system) and vector data software are used in drilling, patterning and cutting structure. This equipment is a PCB manufacturing company, which can produce HDI PCB (high density interconnect PCB). It can also be used for drilling, cutting and constructing on substrates with various raw materials and mixed layers
Equipment specifications
-Applicable examples
Multi layer PCB
It is a kind of product with high density accessory circuit and short wiring distance by stereoscopic structure PCB with inner and outer loop. Application: mainly used in large computer, PC, communication equipment, small household appliances, etc
IVH PCB(Interstitial Via-hole MLB)
With the development of high-tech miniaturization of electronic equipment, the number of layers in the design of high-density PCB circuit increases due to the increase of wiring amount.
Therefore, in order to reduce the area occupied by via hole, a part of via hole should be processed to minimize the area occupied by circuit connection holes
Usage: it is mainly used in mobile phone and portable PC.PDA And other high-performance small electronic equipment
FPCB(Flexible Printed Circuit Board)
We often call it flexible circuit board, commonly referred to as FW (flexible wire) and FC (flexible circuit) in Europe or America. It refers to the flexible and tortuous wiring substrate formed by precise small circuit between polymer base and coverlay, which has outstanding insulation and heat resistance
3.Micro machining equipment
·Applicable / applied images
Stents machining
4.Patterning device
Light guide plate patterning equipment
-outline
The device of light guide plate morphological entering Blu (back light unit)
TFT-LCD (thin film transformer liquid crystal display) is a kind of flat panel display. Transistors are fixed on the glass substrate. Driving unit, BLU)
Blu (back light unit) is a dimmer for the uniform transmission of light in the whole panel of TFT-LCD
(light guide panel) the LED light emitting on the edge reflects or diffuses, and plays the role of uniform transmission of light on all sides of LCD
-structure
-Light guide plate patterning Engineering
Equipment appearance
Specifications
Applicable examples
Ito patterning equipment - Summary
Dry etching equipment using ITO film on laser, film or glass surface
- Patterning project
equipment
Specifications
Applicable examples
5.Marking equipment
Sapphire wafer marking equipment
-outline
This equipment is used to mark the serial number ln line of the product after measuring and checking the stain, bubble, working face and shape of sapphire cake shaped pipe socket
In particular, the utilization of CO and laser source is based on the economical equipment price and maintenance / repair cost. Users can choose the laser output according to the requirements, and the processing line width and marking range can also be selected
Equipment specifications
·Applicable examples
Serial number marking of surface products of sapphire cake shaped tube socket
Fiber laser marking equipment
-outline
Fiber laser marking system is a kind of equipment that can produce high-quality laser marking on metal (SUS, aluminum, etc.) and plastics. The advantage of this system is that as a small product, it can better correspond to and adapt to users, and has a long service life and low maintenance cost.
Materials with 3D scanner curved surface and flexible can also be applied, and can be adjusted and corresponding to a variety of applications other than marking.
Equipment specifications
Applicable examples
